Description
Diameter range: D0.3–D3
Suitable for monocrystalline silicon, ceramics, sapphire, and similar brittle materials
Designed for high-efficiency micro-hole machining
High edge sharpness and wear resistance
Supports precision production requirements in electronics and advanced materials processing
Typical Applications
Semiconductor-related parts
Ceramics and sapphire components
Precision micro-hole drilling
Hard and brittle material machining
You may fill in the PCD inquiry form below so we can recommend a suitable grade and insert type based on your actual machining conditions.
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| Drawing or Photo Upload | Please send to email: samliao@heyipt.com | ||||
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